3DLABS Windows CE BSP
Posted on Feb 22, 08 07:10 AM PDT

3DLABS will be parading its Windows CE BSP (Board Support Package) at Embedded World, Nuremberg, Germany, bringing the advantages of the DMS-02’s fully programmable media processing array and dual ARM architecture to the masses. The DMS-02 claims to deliver "unrivalled application and media performance for embedded and low-power consumer electronics devices such as connected media players, portable navigation units, service terminals, smartphones and gaming devices". I don't know how far its dual ARM 926 multi-core System-On-Chip processors are able to handle 2D/3D graphics and video encoding/decoding and image processing though, but it sure sounds promising in theory. [Press Release]
Your Comments
Comments will be published immediately if you use a Disqus, Facebook or Twitter account. Anonymous comments will be moderated.
Featured Posts
Top Stories
Google OSes might merge
Flare wind-sensitive electronic dress
Pogoplug 2 announced, looks great
Free In-flight Wi-fi on Virgin America by Google
Google Chrome OS, What's New?
Frictionator Ford F650 gets jet engine
Apple tablet delayed again
DermaStream CST system to get FDA approval
BiliChek bilirubin measurement system



