Published on 04/16/2008
The word on the street is that United Microelectronics (UMC) is manufacturing the 3G chip that is supposed to power the next iPhone, using a 65nm process. The chip (Infineon PMB8878, or SGOLD3 in the Apple SDK) would be from Infineon as previously posted. If you work in the semi-conductor industry, you know that Taiwan is leakier than a colander. Once the info hits Taiwan, everyone knows what the competition is doing – not cool, but when it comes to semi-conductor manufacturing, that is the best place.
Infineon PMB8878 features