Looks like camera modules for cellphones will soon shrink even further thanks to the efforts of Oki. They have successfully developed camera modules that are half the size of conventional ones, with volume production to begin really soon. This effort is made possible by miniaturizing the image sensor in the camera module by creating a through-hole in the silicon substrate and putting an electrode through the hole. This does away with the need for wire bonding for camera modules, resulting in a reduced size. Not only that, Oki uses a low-profile cover glass on the image sensor to make the module thinner than conventional ones.
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