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3DLABS Windows CE BSP

3DLABS will be parading its Windows CE BSP (Board Support Package) at Embedded World, Nuremberg, Germany, bringing the advantages of the DMS-02’s fully programmable media processing array and dual ARM architecture to the masses. The DMS-02 claims to deliver “unrivalled application and media performance for embedded and low-power consumer electronics devices such as connected media players, portable navigation units, service terminals, smartphones and gaming devices”. I don’t know how far its dual ARM 926 multi-core System-On-Chip processors are able to handle 2D/3D graphics and video encoding/decoding and image processing though, but it sure sounds promising in theory. [Press Release]

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