Hitachi’s latest finger vein authentication module is extremely thin at just 3mm, which is phenomenal compared to what Hitachi has on offer at the moment that measures 23.5mm in thickness, making it around 7 times more svelte. Volume production of this module will begin in two years’ time, seeing action in various mobile devices including cellphones and possibly portable hard drives and media players. This fingerprint module will feature a pixel count of 150 x 100, while offering a pitch of 0.1mm. A light-blocking layer is located between each two of the pixels for added effect.
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