[MWC 2011] Qualcomm has just announced its latest mobile chipset, namely the MDM8225. This chipset offers full support for HSPA+ Release 9/HSPA+ 84Mbps. T-Mobile already has plans for HSPA+ 84Mbps and also HSPA+ 168Mbps, so this is definitely a step in the right direction. This latest chipset will support dual-carrier technology, allowing it to utilize multiple frequencies at the same time. T-Mobile’s 3G/4G network already uses the 1700MHz and 2100MHz frequencies, so this chipset will be able to support both frequencies simultaneously. The chipset also uses Qualcomm’s interference cancellation and equalization (Q-ICE) receiver, helping to reduce the amount of dropped calls. Qualcomm is planning to have samples of these chips available in Q4 this year and the first devices are expected to roll out in 2012.
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