If all the recent chatter turns out to be true then HTC might also be cooking up a “prime” variant of its 2014 flagship. Over the past few weeks there have been countless rumors about the Samsung Galaxy S5 Prime, a supposedly upcoming variant that’s crafted from metal and has better specifications than the Galaxy S5. We’re now hearing that the HTC M8 Prime will give it and the LG G3 a run for their money.
The latest comes from infamous Twitter leaker @evleaks who is rarely wrong about these predictions. It is said that the HTC M8 Prime is going to have a 2.5Ghz Qualcomm Snapdragon 810 quadcore processor coupled with 3GB of RAM. An outstanding 5.5-inch 2,560×1,4440 “2K” display will also be onboard.
Both Samsung Galaxy S5 Prime and the LG G3 are believed to come with this particular type of display, save for slight differences in the actual size. HTC’s premium smartphone may also have Cat 6 LTE which would provide theoretical download speeds of up to 300Mbps. Carrier support will be required before users can actually notice a difference in speeds.
HTC is reportedly going to use an “exotic” material to build this smartphone. That would certainly help it set the device apart from the rivals. Apparently a composite of aluminum and liquid silicone a.k.a Al-SiC will be used. The metal is known to provide the benefit of high thermal conductivity and low coefficient of thermal expansion.
It is also claimed that for the HTC M8 Prime the company is going to take page out of Sony and Samsung’s book to make the smartphone both dust and waterproof. This will be HTC’s first device that’s immune to the elements, both aforementioned companies have already been releasing dust and waterproof devices for a long time now.
No word as yet on when HTC is planning to unveil the M8 Prime.