It hasn’t been too long since 2015’s Moto X devices were announced, but it looks like rumors of next year’s Moto X has already been making their rounds. Just last week a photo surfaced which showed the alleged chassis of the Moto X (2016). Now thanks to a newly leaked photo, the inside of the chassis has been revealed.
As you can see in the photo above, it shows off the innards of the upcoming phone and in the photo, it also shows a heat pipe that will be used to cool the phone. Why does the phone need a heat pipe? So far most phones have gotten along fine without one, but the rumors have claimed that the Moto X (2016) will be powered by a Qualcomm Snapdragon 820 which will apparently run pretty hot, or so the rumors claim.
In fact an earlier rumor about the Samsung Galaxy S7 has suggested that because it will be using the Snapdragon 820, it will also need heat pipes in order to keep it cool. We should point out that the Snapdragon 820’s operating temperatures are only rumors at this point. We can only assume that whatever issue it was with the Snapdragon 810, Qualcomm would have fixed by now.
We also can’t be sure if the photo is indeed that of the Moto X (2016) so until we hear otherwise, it’s best to remain skeptical so take it with a grain of salt for now.
Filed in . Read more about Moto X (2016) and Motorola.