The Qualcomm Snapdragon 820 processor is currently being manufactured by Samsung on its second-generation 14nm LPP FinFET process and if a new report is to be believed, the company may have contracted Samsung yet again to mass produce its next-generation mobile processor. A report out of South Korea suggests that Samsung is going to manufacture Qualcomm’s Snapdragon 830 processor on its 10nm process, this mobile processor is going to power high-end devices destined to hit the market in 2017.
The report also claims that the Snapdragon 830 is going to be used for the Galaxy S8 as well. Samsung is expected to use the Qualcomm processor for Galaxy S8 models destined for the United States while international models will use Samsung’s own Exynos 8895 processor.
The Samsung Exynos 8895 processor is also going to be made on the 10nm manufacturing process like the Snapdragon 830. It’s claimed that both Samsung and Qualcomm are working to produce FoPLP (Fan-out Panel Level Package) technology which will eliminate the need for a printed circuit board for the package substrate which will be used in both of their next-generation processors.
No further information is available about these next-gen chips right now but we’re likely to hear more about them in due time. Samsung and Qualcomm have not yet confirmed if they will be renewing their manufacturing contract for the Snapdragon 830.
|Key Specs||Galaxy S8|
|Display Diagonal||5.2" (13.21 cm)|
|Max. Total Storage Capacity||384 GB|
|Complete product data||Samsung Galaxy S8 Full specs and details|