Quite a lot of people were not impressed when they found out that the most amount of battery capacity they can get with the company’s 2017 flagship smartphone is 3,500mAh and that too if they opt for the more expensive model, the Galaxy S8+. They would have certainly preferred to have more battery capacity without having to pay more money for the larger handset. Their concerns might be addressed with the next flagship as the Galaxy S9 will reportedly make one fundamental change to accommodate a larger battery.

According to a new report out of South Korea, the Galaxy S9 is going to have a stacked logic board which is called a substrate-like PCB mainboard. This will free up more space inside the device and thus enable Samsung to put a bigger battery inside the Galaxy S9 without increasing the dimensions of the handset itself.

If Samsung does end up doing this, it will be the first time that it adopts the advanced logic board based on chip packaging technology. Apple is also believed to have used the same upgraded mainboard technology for the iPhone 8 to make the handset slimmer.

The substrate-like PCB board is a more advanced iteration of the existing HDI circuit board. The stacked design improves space efficiency considerably and frees up more space inside the case for a larger battery or other components.

Samsung is expected to switch to the upgraded mainboard for variants of the Galaxy S9 that feature its own next-generation Exynos processor. Since it’s too soon to be certain about anything related to the Galaxy S9, it would be best to take this with a grain of salt for now.

Filed in Cellphones. Read more about and .

5.8"
  • 2960x1440
  • Super AMOLED
  • 568 PPI
12 MP
  • f/1.5 Aperture
  • OIS
3000 mAh
  • Non-Removable
  • Wireless Charging
4GB RAM
  • Snapdragon 845
  • MicroSD
Price
~$445 - Amazon
Weight
163 g
Launched in
2018-02-25
Storage (GB)
  • 128
  • 256
  • 64

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