LG has made no secret of the fact that it’s going to unveil a new flagship smartphone at MWC 2019 in Barcelona. The company also revealed that the LG G8 ThinQ is going to feature a 3D time-of-flight sensor for improved facial recognition.

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LG has worked with Infineon Technologies to incorporate the latter’s REAL3 image sensor chip in the LG G8. The company says that this new chip will “deliver a new level of front camera capability in a smartphone.”

The time-of-flight sensor uses infrared light to develop a 3D model of the subject for facial recognition. Other 3D technologies use complex algorithms to calculate the object’s distance from the camera lens. The phone thus requires less processing power and energy with a ToF sensor for facial recognition.

The depth measurement capabilities of this sensor allow for improved portrait shots as well so expect the LG G8 to apply a better bokeh effect to your selfies. It’s also ideal for implementation in augmented reality and virtual reality applications.

Leaked renders of the LG G8 show that the device is going to have a notched display. LG will talk about it in detail at the upcoming Mobile World Congress 2019 which begins February 25th in Barcelona.

Filed in Cellphones. Read more about and . Source: lgnewsroom

6.3"
  • 3120x1440
  • P-OLED
  • 545 PPI
12 MP
  • f/1.5 Aperture
  • OIS
3500 mAh
  • Non-Removable
  • Wireless Charging
6GB RAM
  • Snapdragon 855
  • MicroSDXC
Price
~$620 - Amazon
Weight
167 g
Launched in
2019-02-01
Storage (GB)
  • 128
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