There does not seem to be anything that modern day technology cannot do, and when it comes to memory for computers and other kinds of consumer electronics devices, those tend to expand exponentially when it comes to the total capacity. Well, the Hybrid Memory Cube Consortium has been working for quite the longest time already on developing a standard for for its technology, taking 17 months or so to date, but at last, the fruit of their labor is about to be revealed.
The Consortium recently published their HMC Specification 1.0, which basically enables companies to build platforms and RAM using 2GB, 4GB and 8GB chips, where these will also incorporate the stacked, power-efficient technology, without having to go through the headache of compatibility issues from different supporters. It seems that when equipped with eight links, a memory cube is capable of hitting a peak 320GB/s of aggregate bandwidth, now how about that? Consider how current DDR3 memory achieves approximately 11GB/s at this moment. The future is indeed bright.
Next Story: Sonnet Echo 15-Port Thunderbolt Dock
- 2013-04-02: Hybrid Memory Cube Paves The Road To A Bright Future
- 2012-06-27: Samsung pushes LPDDR3 memory into next-gen devices
- 2011-12-20: Panasonic, Samsung, Sandisk, Sony and Toshiba form the Next Generation Secure Memory Initiative
- 2011-11-28: AMD Radeon Memory should be an easy choice
- 2011-11-02: Monster and SDJ Technologies enter into memory storage deal
- 2011-10-10: iPhone 4S has 512MB RAM (Rumor)