Toshiba will mass produce a 14.6-megapixel CMOS sensor from Q3 next year onwards, where this little chip is manufactured using Toshiba’s 65 nm process on 300 mm wafers, capable of yielding around 500,000 sensors a month when production begins. Features include support for back-side illumination, and it remains to be seen whether cellphones shipping next year will see this 14.6-megapixel CMOS sensor in action or not.
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