Over the past few months we have heard many rumors of what to expect from Apple in 2014. The company is rumored to release new iPhones, iPads as well as a wearable device this year. Its iOS powered devices might be powered by an A8 chip, and rumor has it that Apple has already started tapping suppliers who will supply the package-over-package system-on-chip, which basically means that the processor and mobile DRAM will be joined together into one single package.
According to infamous Taiwanese trade publication Digitimes, Apple has tapped STATS ChipPAC, Amkor Technology and Advanced Semiconductor Engineering to fulfill packaging orders for the A8 chip, which is rumored to power the next generation iPhones and iPads. Citing upstream supply chain sources, the publication also claims that Taiwan Semiconductor Manufacturing Co. has plans to ramp up its production of the 20nm manufacturing process so that it too can begin mass production of the Apple A8 chip. Production is expected to being in the second quarter of this year, with ASE rumored to handle 20 percent, and Amkor and STATS handling 40 percent each. As far as the production is concerned, it has been rumored a lot of times that TSMC will finally clinch away orders from Samsung. Perhaps the Taiwanese manufacturer will be able to aid Apple in its mission of ending reliance upon Samsung this time around.