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The Qualcomm Snapdragon 810 is a chip which will power many high-end smartphones this year, infact the first smartphone to tout it has already been confirmed, the G Flex 2 from LG. Last month we heard rumors that due to certain issues with the processor it could be possible that Qualcomm might face delays in shipping it out to manufacturers. Those rumors have resurfaced again today even after Qualcomm said that everything was on track as far as the Snapdragon 810 is concerned.

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Qualcomm’s new processor is said to have an overheating problem which is getting in the way of mass production. Reports out of Korea cite two J.P. Morgan analysts who claim that both Snapdragon 615 and 810 have overheating issues, with the problem persisting in the latter. Apparently the Snapdragon 810’s Cortex-A57 cores the reason behind this when they go over frequencies of 1.2-1.4GHz.

It is now said that the mass production might be pushed back by as much as five months which would mean that the Snapdragon 810 might not be available in high volumes until at least the second quarter of 2015. This wouldn’t fare well for companies who are counting on this chip for their next-generation devices, like the Galaxy S6, HTC Hima and others.

Qualcomm hasn’t responded to these rumors as yet, it did reach out when we first about potential issues with Snapdragon 810, so lets just wait and see what the company’s response to this is going to be.

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