It was first reported last month that Qualcomm had been facing overheating issues with the Snapdragon 810, particularly when it was operating at peak frequencies, and that the time it would take the company to fix this issue will cause shipment delays for OEMs. Qualcomm denied the initial report but remained more or less tightlipped on subsequent reports of the issues persisting. It is now being reported that Qualcomm has finally taken care of the overheating issue with its new processor and that its going to ramp up production starting next month.
Qualcomm recently confirmed that a “large customer” had decided not to use the Snapdragon 810 for its flagship. Many though it was pointing to Samsung, which is believed to have shifted towards its own Exynos processors for the new flagship, which might be more of a business decision on the company’s part.
A Chinese analysts with links in the TSMC foundry, where these chips are being manufactured, claims that the initial overheating issues with Snapdragon 810 at peak frequencies have been fixed.
TSMC will ship these chips to OEMs in due time and the foundry is reportedly going to ramp up production of the silicon by mid-March. That’s around the time many of the flagships announced by OEMs will be nearing their shipping dates.
The possibility exists that Samsung might go with the Snapdragon 810 processor for Galaxy S6 in certain markets but most of them are likely going to be powered by the new Exynos chip.