VIA intends to revolutionize things yet again with their new Mobile-ITX platform that measures a cool 6cm x 6cm, while is around 50% smaller compared to the Pico-ITX form factor. Specially built for next-generation embedded devices, Mobile-ITX will rely on a modularized design that comprises of a CPU module card and an I/O carrier board. Other features include integrated core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals. Commercial Mobile-ITX-based CPU modules are expected to ship sometime in Q1 next year.