It’s not uncommon to see many leaks and rumors ahead of the launch of new iPhones. Apple is going to unveil the iPhone 7 later this year in the fall and we’ve already heard many rumors about this handset. One suggests that Apple is going to remove the 3.5mm headphone jack from its next iPhone. A new rumor claims that the headphone jack won’t be removed and that the iPhone 7 will gain dual-SIM support.
The rumor is based on component leaks out of China. One of those components is said to be the Lightning cable assembly for the iPhone 7. We can see in the image that it has a 3.5mm headphone jack attached to it.
Purported images of the next iPhone’s SIM trays have been posted online as well. They show that the handset will have support for dual-SIM. If that’s true then the iPhone 7 is going to be the first smartphone from Apple to have dual-SIM support. Additional rumored components that have been leaked online include a 256GB memory chip.
It’s also not uncommon for Apple to test multiple prototypes of a new iPhone before settling on what it deems to be the best product it can come up with for the year. Even if there’s some truth to these rumors it can’t be said for sure if all of this will turn out to be true when the iPhone 7 is launched.
As always, Apple has not commented on these rumors and leaks.