Samsung today revealed that it’s going to unveil the next-generation UFS 3.0 storage solutions next year. The confirmation came from the company’s head of mobile memory product planning Jay Oh at the Qualcomm 4G/5G Summit in Hong Kong. UFS 3.0 storage will be available in 128GB, 256GB, and 512GB capacities.
Micron, another memory chip maker, has said that the first smartphones with 1TB of internal storage will arrive by 2021. The first integrated 1TB module for smartphones is expected to be ready by then.
The UFS 3.0 standard will allow for a major increase in performance. Samsung says that there will be a 2x surge in memory bandwidth compared to UFS 2.1 which is the flash storage standard currently used in mobile devices. This will be possible while retaining the same footprint so these memory chips won’t be larger.
UFS 3.0 solutions are certainly required as commercial 5G networks come online next year. They will enable new services and experiences which will require faster storage solutions. Whether or not Samsung ships UFS 3.0 memory with the Galaxy S10, its next flagship smartphone due in Q1 2019, remains to be seen. The company is expected to launch a separate 5G variant of the Galaxy S10 so perhaps that particular model may tout UFS 3.0 storage.