Older PlayStation 5 models are starting to report overheating issues caused by the natural degradation of their liquid metal thermal interface. The issue was highlighted by Polish technician Modyfikator89 while performing maintenance on a PS5 (CFI-1116 series) console that suffered from sudden thermal shutdowns.
During disassembly, the technician discovered crystallized residue and severe discoloration around the APU and the heatsink contact base. This indicated that the liquid metal had lost its uniform distribution over years of continuous operation, forming dry spots that hindered proper heat dissipation.
Despite visible oxidation on the contact area, cleaning revealed that the processor core remained undamaged. However, the heatsink base suffered permanent marking where the protective nickel layer ruptured, exposing the underlying copper to the thermal compound.
The gallium present in liquid metal alloys naturally reacts with copper, weakening the metallic structure once the nickel barrier breaks down. According to iFixit repair guides, the compound can oxidize and lose efficiency over time, causing physical wear that leads to severe thermal throttling.
PS5 Liquid Metal Nightmare Has Just Begun! 😱 Gallium diffusion just ate the heatsink in an early PS5 model!
This CFI-1116 unit came in with severe overheating. The liquid metal completely broke through the protective plating, forming a rock hard alloy crust and leaving a… pic.twitter.com/ImoQxJcvOe
— modyfikatorcasper (@Modyfikator89) August 11, 2026
The finding has sparked debate among repair technicians regarding long-term maintenance. Simply reapplying liquid metal to a corroded heatsink may not restore proper thermal conductivity, prompting professionals to consider alternatives like the PTM7950 phase-change thermal pad.
While this single case does not confirm a chronic failure across all CFI-1116 units, Sony has already updated the APU thermal reservoir design in newer console revisions to prevent compound migration.
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