There have been rumors that the Qualcomm Snapdragon 810 was facing overheating issues, although companies such as LG who uses the Snapdragon 810 have since denied those claims on Qualcomm’s behalf. That being said could the rumors be true? According to the folks at Dutch website Tweakers (via Phandroid), they recently got their hands on the HTC One M9 that seems to prove it.
The website put the handset through a benchmarking stress test and according to their results, the HTC One M9 is one hot device, literally! From their findings it was discovered that the HTC One M9 reached temperatures of over 130-degrees Fahrenheit (55 Celsius), making it significantly and noticeably hotter than competing devices as you can see in the image above. In fact the closest handset was the LG G3 which was still around 13 Celsius cooler.
HTC’s Jeff Gordon has since released a statement on Twitter which reads, “PSA: One more time, all together now: HTC One M9 software isn’t final yet, no matter how many pre-release benchmarks you run.” Interestingly enough Gordon’s statement seems to be in line with a report from earlier today that suggested that the phone’s release was delayed in Taiwan over software issues. We wonder if this could have something to do with it.
However like Gordon points out this is based on software that isn’t final yet so a lot could change from now until its release, so hopefully this is considered “normal” during the testing phase and that the final release should not give us any problems. Perhaps investing in liquid cooling might be a good idea? The HTC One M9 was supposed to be released in Taiwan yesterday, but there is still no word from HTC with regards to a release stateside.
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