Until Apple officially announces the next generation iPhone there’s no stopping the rumors and the leaks. Often they give us an idea of what to expect from the company but one must take all this information with a grain of salt since it comes from unofficial sources. The latest leak comes from China and we get to see what is claimed to be the iPhone 6 logic board. Accompanying information states there will be an ultra-fast 802.11ac Wi-Fi as well as a Near Field Communication chip onboard.
Both of these wireless connectivity features will be a first on the iPhone. For long it has been rumored that the iPhone will come with NFC and we are hearing those rumors again for the iPhone 6. NFC would enable e-payment functionality that is already available on rival platforms.
While Nowhereelse.fr claims the source it has received these pictures from is “particularly reliable,” the logic board itself doesn’t show any of the chips. There’s no A8 processor, RAM or the rumored Wi-Fi chip soldered on the logic board. The leaked is simply a bare logic board. However the mounting brackets of this leaked part line up with leaked panels of the 4.7-inch iPhone 6 that we have already seen multiple times.
Since most of Apple’s Mac lineup already supports 802.11ac Wi-Fi, it would make sense for Apple to bring its iPhone up to that same level as well. Suppliers who will provide Apple with these chips are not known as yet.
Apple is expected to unveil the iPhone 6 this September, apparently it is going to announce two new models at the event.
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