Image credit - iFixit

Image credit – iFixit

The other day we heard an interesting report in which it was revealed that for the upcoming LG G6, LG would be integrating copper heat pipes into the phone which will help to dissipate heat from the phone more effectively. A phone that is properly cooled will not only run better, but it also reduces the chances of it getting too hot and exploding.

Turns out LG isn’t alone in this because according to a report from DigiTimes, it seems that Samsung could be adopting similar technology for the Galaxy S8. Both LG and Samsung are extremely fierce rivals they both tend to follow in each other’s footsteps, so it wouldn’t really be a surprise to learn that they both could have decided to include heat pipes in their phone.

In LG’s case it has been more or less confirmed, but for Samsung the jury’s still out on the report so take it with a grain of salt for now. However given the snafu and disaster that was the Samsung Galaxy S7, we wouldn’t be surprised if Samsung decided to be more cautious when it came to the safety of their phones.

In any case we expect we will learn more about the handset once it is announced, which last we checked could either be taking place in late March or early April.

Filed in Cellphones >Rumors. Read more about and .

  • 2960x1440
  • Super AMOLED
  • 568 PPI
12 MP
  • f/1.7 Aperture
  • OIS
3000 mAh
  • Non-Removable
  • Wireless Charging
  • Snapdragon 835
  • MicroSD
~$369 - Amazon
155 g
Launched in
Storage (GB)
  • 64

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